To Focus On Customer’s Success Ultimately Leads To Customer Satisfaction
Assembly Capacity & Capabilities With Existing Setup
SMD Assembly – Fine Pitch QFP/QFN/BGA components, 0603 size chip components in production.
Spare Capacity as on today – 50K components
BGA Assembly with inspection / X-ray
Through-hole Assembly – Separate line for Tin-Lead & ROHS
Spare capacity as on today – 500 PCB’s per day
Mixed Assemblies – SMT + Discrete Double-sided SMT assembly.
Electro-Mechanical Assembly – System or Subsystem level assembly and integration of
Customized Testing – EOL Testing as per customer requirements to suit the product and applications
- Team of 10 Engineers for testing of customized products.
- Dedicated EOL test setups for products.
- DC Power supplies, DMM, Oscilloscope, and Variac available for testing.
- LCR bridge for Impedance checking.
- EV Lighting – PCB Level Products.
- Separate test area for industrial products